IBIS Open Forum Minutes
Meeting Date: December 9, 2011
Meeting Location: Teleconference
VOTING MEMBERS AND 2011 PARTICIPANTS
Agilent Radek Biernacki*, Fangyi Rao, Amolak Badesha,
Hiroaki Sasaki, Sho Okuyama, Toshinori Kageura
Altera Hui Fu, Zhuyuan Liu, Julia Nekrylova,
David Banas
AMD Nam Nguyen, Tadashi Arai
ANSYS (Ansoft) Samuel Mertens, YanJun (Yuki) Chen, Minggang
Hou,
Rui Li, Eiji Nakamoto, Miyo Kawata, Kazuhiro
Kadota,
Toru Watanabe, Yuji Saeki, Nai-Jen Hsuan,
Benson Wei, Jack (ChunKun) Wu
Apple Computer (Matt Herndon)
Applied Simulation Technology Norio Matsui, Osamu Nakamura
Cadence Design Systems Terry Jernberg*, Ambrish Varma*, Dennis Nagle,
Martin Biehl, Yukio Masuko, Aileen
Chen,
Lanbing Chen, Yubao Meng, Liu Ping, Yitong
Wen,
Dingru Xiao, Benny Yan, Jinhui Zhang, Rong
Zhang,
Weijan Zhang, Alex Zhao, Zhangmin Zhong,
Zhongyoung Zhou, Morihiro Nakazato, Joseph
Kao
Charlie Shih, Feras Al-Hawari*
Cisco Systems [Syed Huq], [Mike LaBonte], Luis Boluna,
Ashwin Vasudevan, Zhiping Yang, Greg (Guan)
Fu,
Xinyi Hu, Jiang Wang, Zhongfu Gu, Lihua Yuan,
Xinghai Tang, Yang Wu, Chunyuan Zhou
Ericsson Anders Ekholm*
Foxconn Technology Group Gina Chen, Eric Hsieh, Gerald C.J. Hsu,
Scott C.S. Li,
Delbert Liao, Mandy Su, Joyce C.Y. Yeh
Freescale Takahiro Sato
Green Streak Programs Lynne Green
Huawei Technologies Xiaoqing Dong, Yu (Jeff) Chen, ZhenXing
Hu,
Chunxing Huang, Peng Huang, Randy Zhao,
Hongxing Jiang, Qiang Lin, Longfang Lv,
Zhengrong Xu, Zhou Yi, Hongcheng Yin,
Tinghou Chen, Luyu Ma, Gezi Zhang, Iris Lou,
Tuhua Yu, Ying Zhang
IBM Adge Hawes*, Greg Edlund, Evelyn Kuo, David
Lai
Kent Dramstad*
Infineon Technologies AG (Christian Sporrer)
Intel Corporation Michael Mirmak*, Udy Shrivastava, Heather Monigan,
Jinsong Hu, Y.L. Li, Yinglei Zheng, Long Yang,
Weifeng Shu, Kevin Daverin, Jimmy Hsu,
Morgan Tseng
IO Methodology Lance Wang*
LSI Brian Burdick*
Mentor Graphics Arpad Muranyi*, Ed Bartlett, Vladimir Dmitriev-
Zdorov,
Steve Kaufer, Chuck Ferry, Kenji Kushima,
Minoru Ishikawa
Micron Technology Randy Wolff*, Andrea Spiezia, Roberto
Izzi,
Aniello Viscardi, Giovanni Guerra,
Francesco Madonna, Giuseppe Fusillo
Nokia Siemens Networks GmbH Eckhard Lenski*, Xiaoguang Cai, Hongwei Fu,
Bruce (Zhenshui) Qin, Xiaoping Yang,
Xiangpeng Yao,
Jieping Zhang, Xianzhao Zhao
QLogic David Choe, James Zhou
Signal Integrity Software Walter Katz, Todd Westerhoff, Mike
Steinberger,
Barry Katz, Mike LaBonte*
Sigrity Raymond Chen, Kumar Keshavan, Yingxin
Sun*
Li Li, Kezhou Li, Jing Wang, Xingfeng Li,
Haisan Wang, Zuli Qin, Lily Luo, Polin Chi,
Joshua Luo,
Jack W.C. Lin, Thunder Lui
Synopsys Andy Tai, Ted Mido, Scott Wedge, Xuefeng Chen,
Maggie Dai, Zerui Fan, Wenyun Gu, Jianghua
Huang,
Bo Liu
Teraspeed Consulting Group Bob Ross*, Kellee Crisafulli, Tom
Dagostino,
Scott McMorrow
Texas Instruments Casey Morrison, Alfred Chong
(National Semiconductor - [Hsinho Wu], Pegah Alavi, John Goldie
merged with TI)
Toshiba Kenji Ito, Shigeo Kida, Yasuki Torigoshi,
Yasutaka Oodake
Xilinx (Raymond Anderson)
ZTE Bi Yi, HuaZheng Cao, Fenling Gao, Xiaolin
Ghen,
Mai Hu, Wei Jia, Hui Jiang, Ganghui Li,
Wanming Mao, Baofei Qian, Anbing Sun, Hao
Tian,
Junfeng Wang, Yingxin Wang, Yunfeng Wang,
Meihua Xu, Changgang Ying, Qiang Zhang,
Wei Zhou, Zhi Zhou, Jiangrong Xiao, Xiaobing
Zhang,
Zhiwei Yang, Shenghu Wang, Dawei Sun, Cheng
Li,
Lu Li, Li Wang, Renjie Wang, Jie Yu, Shunlin
Zhu
Zuken Hirohiko Matsuzawa, Hironari Kibe, Makiko
Shimizu,
Yuichi Nakajima
OTHER PARTICIPANTS IN 2011
3M Kylin Chen, Shiang Yao
Accton Technology Daniel Lin, Stu Tsai, Rolf Wu
Advantech Kalyuan Cheng
Advantest Cassity Chao, Ashley Huang
AET Mikio Kiyono, Chihiro Ueda
Alchip Technologies John Chou, Adam Su
ALi (Alitech) Allfor Chen, Yigong Lu
Altek Randy Hsiao
Amphenol TCS Kenneth Cheng
Anymid Group Charles Zhou
Apache Design Solutions Shulong Wu
Apollo Giken Mitsuo Kaetsu, Naoyata Iisaka, Satoshi
Endo
Arrow Electronics Ian Dodd
ASE Group Joey Huang
ASUSTek Computer David Chou, Yu-Ching Liao
ATE Service Yutaka Honda
Avant Technology Enson Lee, Jyam Huang
Avago Weiping He, Minh Quach, Sari Tocco
Axell Nobumasa Iwakoshi
Bayside Design Elliot Nahas
Broadcom Mohammad Ali
Bureau of Standards, Meterology Yentang Chang, MS Lin
& Inspection (BSMI)
Canon Kohji Hirai, Matsumoto Shoji,Takamasa
Sakuragi,
Yoshihiro Kobayashi
Canon Components Syohtaro Hiramatsu
Casio Computer Yasuhisa Hayashi
Celestica Sophia Feng, Lily Dai, Jason Liu, Yunqiang
Meng,
Junwei Zhang, Harrison Xue, Van Zhu
CST Martin Schauer
Cybernet Systems Masahito Kobayashi, Takayuki Tsuzura
Delta Network Sandy Chen, Nick Chiou, Alston Hsia,
Skipper Liang,
David Huay
Denso Kouji Ichikawa, Takahiro Tsuda
East China Normal University Mengting Liao
Eastwell David Wu
EDADOC Technology Hansheng Ke, Bruce Wu
Electro System Kazuyuki Saijo
EMC Corporation Abigail Jiang, Peng (Tony) Liu, Lynn Kong,
Chambers Yin
E-Train Technology Weiming (David) Lu
Etron Technology Frank Cheng, Fred Hsieh, David Lin, Janice
Chen
Exar Corporation Helen Nguyen
Farady Technology Boris Tseng, Sun Pao
Flextronics Golden Qiang, Chris Pan
Fujitsu Advanced Technologies Hiroyuki Kawata, Syogo Fujimori, Toshiro
Sato
Fujitsu Electronics Kenji Goto
Fujitsu Microelectronics Solutions Daisuke Suzuki
Fujitsu Semiconductor Masaaki Suzuki, Motoaki Matsumura, Shintaro
Otani,
Toshiki Iwai
Fujitsu VLSI Hiroki Kubota, Hiroshi Miyazaki, Kyota
Shimizu,
Sizue Kato
Gigabyte Technology Eric Chien, Andy Lee, Johnson Tsai
Giga Hertz Technology Ryuji Kawamura
Global Unichip Peter Lai, Darren Hsu, Nicholas Huang
Granite River Labs Johnson Tan, Mike Engbretson, Quintin
Anderson
H3C Technologies Huanyang Chen, Haitao Zhang, Xiaoqun Li
Hakkao Denshi Eiji Mita
Hewlett-Packard Corey Huay
High Speed Design Center Ben Chia
Hino Jisso Design Sigekazu Hino
Hitachi Makoto Okumura, Ritsurou Orihashi, Shingo
Suzuki
Hitachi Global Storage Takayuki Imai
Technologies
Hitachi Information and Control Hiroyuki Tayama
Systems
Hitachi ULSI Systems Hiroshi Uematsu, Kazuhiko Sugisaki,
Sadahiro Nonoyama
IBITECH Hitoshi Miwa, Kiyohisa Hasegawa
ICT-Lanto Steven Wong
ILI Technology Chia-Cheng (Trevor) Wu
IMU Runjong Zhou
Industrial Technology Research Peng Chen
Institute (ITRI)
Inventec Zhong Peng, Ian Chen, Paul Chu, Jim Lai
Japan Futec Kenji Ishida
JEITA Atsushi Ishikawa
JVC Kenwood Hidetoshi Suzuki
Kawasaki Microelectronics Hajime Kinugasa, Yoshimasa Yahata
KEI Systems Shinichi Maeda
King Yuan Electronics Co. (KYEC) Bernard Hsu, Vincent Hung, Hung Chan Lin
Kyoden Hiroshi Hohga, Katsuhiro Ota, Sinichi Mochida,
Takao Saito, Takehiko Murata
Lapis Semiconductor Kenji Arai
Lecroy Derek Hu
Lite-On Technology Skylar Shin
Marvell Semiconductor Fang Lv, Guobing Han, Yuyang Wang, Liang Wu,
Michael Wang, Xike Liu, Zhiqiang Li
Maxim Integrated Products Hassan Rafat*, Mahbubul Bari*
MD Systems Hidetoshi Ogawa
Mediatek Wayne Tseng, Dean Yang
Micro-Star International Cliff Lin,
Mindspeed Jeff Li, Lyn Wang
Mitsubishi Electric Engineering Toshio Ueda
Nanya Technology K.W. Chao, Benton (Yu Wei) Chen, Roger Chen,
Argy Cheng, Yumin Cheng, Aidan Hsu, Benedict
Hu,
Supon Huang, Wen-Ming Lee, Benson Lin,
Chinghuei Tseng, Vincent Yan, Andre Huang
Ching-Feng Chen, Jordon Hsu
National Taiwan University Chung-Kuan Cheng, Chiu-Chih Chou
NEC Hiroshi Yamaguchi, Tomohiro Hayashi,
Tomokazu Tokoro, Toshihiko Nakano
NEC Communication Systems Tsuneo Kikuchi
NEC Toppan Circuit Solutions Kiyohiko Kaiya, Masanori Naito, Toshiyuki
Kaneko
NetLogic Ryan Coutts, Antonis Orphanou
Nikon Kazuomi Tominaga, Manabu Matsumoto,
Toshiyuki Kobayashi
Nisoul Fumio Tazaki, Toshio Hoshi
Novatek Microelectronics Group Frank Y.C. Pai
Nvidia David Chen, Chia Yuan Hsieh, Chih Wei
(Jason) Tsia
Oki Electric Industry Atsushi Kitai
Olympus Kazuhiro Sakamoto
Olympus Medical Systems Hiroshi Tamai
Oracle Gustav Blando
Panasonic Yoshiyuki Saito
Pegatron Stanley Chu, Gavin Lin
Pericom Semiconductor Zhangqi Guo, Jun Li, Qing Mao
Phison Electronics Dageai Liu
Politecnico di Torino Igor Stievano, Stefano Grivet-Talocia
Portwell Michael Chang, Phil Gu
Pristine Signals AbdulRahman (Abbey) Rafiq
Propogate Group Corp. (PGC) Wayne Tsai
Quanta Computer Fu-Chieh Chang, Eriksson Chuang, Allen Kuo,
York Wang, Lengren Wei
Realtek Semiconductor Jerry Chien, Erlang Wang, Tina Wu
Renesas Electronics Takuji Komeda, Masafumi Mituishi, Mikiko
Sode,
Naho Hokoiwa, Osamu Takeuchi, Soji Sunairi,
Tatsuaki Tsukuda
Renesas Micro Systems Munehisa Okita, Yoshihiro Kikuchi
Ricoh Shigeru Isobe, Toshihiko Makino, Yasuhiro
Akita
Rohm Yutaka Okui
Samsung Electronics Il Seong
Samsung Yokohama Research Toshiyuki Hasegawa
Institute
Sanritz Automation Masamichi Yahara
Shimadzu Kazuo Nakajima
Siemens Manfred Maurer
Signal Khobho Atsuhito Noda
Signal-Lab Sei Shida
Silicon Motion Technology Louis Chuang, Star Wang
Singatron Enterprise Norman Wu
Simberian Yuriy Shlepnev
Sony EMCS Shigeru Sana
Spreadtrum Communications Xianyu Meng
ST Microelectronics Fabio Brina, Alan Smith
Sunplus Technology Forest Hsu, Yitzeng Lin
Taiwan Semiconductor Philip Way Chang
Manufacturing Corp. (TSMC)
Taiyo Yuden Masayuki Satou
TDK Katsufumi Ehata, Yoshikazu Fujishiro
TechAmerica (Chris Denham)
Teradyne Makoto Kikuchi, Takeshi Shimabukuro
Tellabs Yuehui Zhu
Thales Communication Alexandre Amedeo, Cyrip Chastang
Tianma Micro-electronics Xiaoyan Lai, Shengjie Yang
Tokyo Cathode Laboratory Akitoshi Nishimura
Tokyo University of Scence Yohtaroh Yasu
Graduate School
Toshiba Digital Media Engineering Kouji Yasutake
Trident Microsystems Andy (Zhiguang) Li
University of Illinois Jose Schutt-Aine
University of L'Aquila Danilo di Febo
VIA Labs Sheng-Yuan Lee
VIA Technologies Cherry Hung, Jonathan Wei
Vitesse Semiconductor Siris Tsang
WADOW Kazuhiko Kusunoki
Wens Heien Hirokawa
Wistron Ryan Chang, Denis Chen, Jesse Chen, Yo An
Chen,
Joseph Chong, Will Chung, Passor Ho, Sindy
Ho,
Soin Huang, Allen Lo, Josh Wu
WonderMedia Technologies Terence Hsien
Xpeedic Technology Feng Ling, Wenliang Dai, Shisheng Wu
Yazaki Kazuki Hattori
YDC Yoshiaki Manabe
YDK Yoshio Takemura
Independent Yoichi Niioka, [Mike LaBonte], Mingwei Chen,
Liping Wang
In the list above, attendees at the meeting are indicated by *. Principal
members or other active members who have not attended are in parentheses.
Participants who no longer are in the organization are in square brackets.
UPCOMING MEETINGS
The bridge numbers for future IBIS teleconferences are as follows:
Date Meeting Number Meeting Password
January 6, 2012 205 475 958 IBIS
For teleconference dial-in information, use the password at the following
website:
https://ciscosales.webex.com/ciscosales/j.php?J=205475958
All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time.
Meeting agendas are typically distributed seven days before each Open
Forum. Minutes are typically distributed within seven days of the
corresponding meeting. When calling into the meeting, follow the prompts
to enter the meeting ID. For new, local international dial-in numbers,
please reference the bridge numbers provided by Cisco Systems at the
following link:
http://www.cisco.com/web/about/doing_business/conferencing/index.html
NOTE: "AR" = Action Required.
----------------------------------------------------------------------------
---------------------------------------------------
INTRODUCTIONS AND MEETING QUORUM
Feras Al-Hawari introduced himself. He has worked for Cadence for over 16
years in the high speed group and is a senior member of the consulting
staff. He is working on simulation and high speed flows.
Mahbubul Bari of Maxim introduced himself. He is working in simulation
modeling in the lab at Maxim. His recent focus has been on IBIS-AMI
modeling, and he has been doing IBIS modeling for awhile. He has
experienced a wide variety of implementation issues with AMI and is looking
to learn more about AMI issues.
Kent Dramstad of IBM introduced himself. He is working with SerDes
modeling. He is interested in learning about problems with AMI modeling to
help solve customer issues.
Yingxin Sun of Sigrity introduced himself. He is working at on simulation
tools using IBIS models.
CALL FOR PATENTS
Michael Mirmak called for any patents or pending patents related to the
IBIS 3.2, IBIS 4.2, IBIS 5.0, Touchstone 2.0 or ICM 1.1 specifications. No
patents were declared.
REVIEW OF MINUTES AND ARS
Randy Wolff called for comments regarding the minutes of the October 28,
2011 IBIS Open Forum teleconference. Bob Ross noted that the next meeting
was to be held December 9, not December 2 as indicated in the minutes.
Minutes were approved with the noted change.
MEMBERSHIP STATUS AND TREASURER'S REPORT
Bob Ross reported that we are now listing Foxconn as a new IBIS member. We
are at 31 members now, but we have no report from TechAmerica to confirm
all membership payments. We will need to address funding at the next
meeting and potentially any increases in membership dues.
WEB PAGE UPDATES
Mike LaBonte reported that he made updates to the Summits page. He is
looking for ways to use scripting to generate better views and readme
information for the Summits page.
MAILING LIST ADMINISTRATION
Mike LaBonte reported that he has had some trouble with the mailing list.
There are 5 different SMTP servers at Stanford, and one of those servers
every few years has a problem where it is used for spam. So, some member’s
email servers pay attention to spam server scores and start blocking emails
from the Stanford server. Mike has contacted eda.org support people, but
apparently nothing can be done to remedy the situation.
MODEL LIBRARY UPDATE
Anders Ekholm reported that he has no update this meeting, but he is
planning to go through links to look for broken ones before the next
teleconference.
MISCELLANY/ANNOUNCEMENTS
None.
OPENS FOR NEW ISSUES
None.
INTERNATIONAL/EXTERNAL ACTIVITIES
- IEEE DASC
Michael Mirmak reported that efforts are ongoing to form a group within
DASC so that IBIS has a path through IEEE for international
standardization. IBIS was tentatively granted 1852 as the working group
number. Group approval is not official yet, because some documentation has
to be signed by TechAmerica related to copyright issues. We should see
some announcements from DASC in the near future. This group is formed
specifically for reviewing IBIS 4.2, but the same group should be able to
work with future specifications.
- VHDL-AMS Table-Driven Models
Arpad Muranyi noted that the last meeting was cancelled. The next meeting
is next Monday. Hassan Rafat asked if Verilog-AMS was supported. Arpad
confirmed that IBIS supports both languages, and Verilog already supports
table driven modeling. More information can be found at:
http://www.eda.org/twiki/bin/view.cgi/P10761/ProjectsArea#Table_driven_
Modeling_Champion_J
- Conferences
EDAPS (Electrical Design of Advanced Packaging & Systems) will be held
December 12-14 in Hangzhou, PRC. More information can be found at:
http://www.edaps2011.org
SPI2012 (18th IEEE Workshop on Signal and Power Integrity) will be held May
13-16, 2012 in Sorrento, Italy. We are offered a free room on Wednesday
afternoon for hosting an IBIS Summit meeting. More information can be
found at:
http://www.spi2012.org
Official IBIS participation is not planned for all of the events above,
though individual papers and discussion on IBIS are encouraged. These are
events with refereed submissions, with deadlines either pending or already
passed.
- Press Update
Bob Ross noted an article by Lynne Green that discusses IBIS models. The
article is “Top 10 Issues in IBIS Modelsâ€, October 19, 2011 on the PCB
Design 007 site. See the article at:
http://www.pcbdesign007.com/pages/zone.cgi?a=79617
IEC APPROVAL ACTIVITIES
Randy Wolff reported that the IEEE DASC announced approval of the IBIS PAR
on October 26 with a 15-0 vote tally among eligible DASC voters and 22-0-1
among all DASC members who voted. See the IEEE DASC topic for further
information.
SUMMIT STATUS
- Asian IBIS Summits Report
Michael Mirmak reported that all three events were very successful. There
was significant sponsorship and presentation material. All presentations
are found on the IBIS Summits page. We had 131 attendees in Shanghai, 152
in Yokohama and 131 in Taipei. Minutes have been released for all
meetings. Power delivery and AMI were dominant topics in the Summits.
- DesignCon 2012 Planning
The IBIS Summit is tentatively scheduled for Thursday, February 2, 2012.
The tentative contract is very similar to last year. Announcements will go
out soon. Michael Mirmak encouraged people to start thinking about
presentations. Lance Wang will be the official contact for sign-ups.
Sponsorship opportunities for all upcoming IBIS summits are available, with
sponsors receiving free mentions in the minutes, agenda, and other
announcements. This includes upcoming events in Asia. Contact the IBIS
Board for further details.
QUALITY TASK GROUP
Mike LaBonte reported that the group is discussing additions of quality
checks for AMI models in the Quality specification. Progress has been
slow, partly due to all the changes in the AMI specification. Until
certain clarifications are approved, some checks that could be in the
ibischk parser have been withheld. The group might start looking at
ibischk to see what further checks could be included. The group meets
weekly on Tuesdays at 8:00AM Pacific time.
The Quality Task Group checklist and other documentation can be found at:
http://www.eda.org/ibis/quality_wip/
MODEL REVIEW TASK GROUP
No update.
ADVANCED TECHNOLOGY MODELING TASK GROUP
Arpad Muranyi reported that the group is now meeting on its regular
schedule after the Summits. They have finished all the small correction
BIRDs. There has been a lot of discussion on a jitter BIRD and the analog
BIRDs.
Task group material can be found at:
http://www.eda.org/ibis/macromodel_wip/
EDITORIAL TASK GROUP
Michael Mirmak reported that there have been no regular meetings since
before the Summits. The group is waiting on a request from TechAmerica
about using the technical writer for some further editorial work. Michael
thinks that we will need to start the editorial work of stitching together
the IBIS 5.1 document ourselves if we do not hear from TechAmerica in the
next day. The group will resume meetings next week hopefully.
The current IBIS 5.0 reformatting documentation can be reviewed at the
following new location:
http://www.eda.org/ibis/editorial_wip/
SPECIFICATION RELEASE SCHEDULE DISCUSSION
Michael Mirmak noted that we need a faster way to update IBIS more
regularly so that new features get into industry more quickly. A period of
two years or so between major updates is too slow. Anders Ekholm brought
up at the Summits the idea of going to regular release schedules of every 6
months so that everyone can plan more easily to implement new features.
IBIS 5.1 is the next scheduled release, but after that, more minor releases
could be done every 6 months on May 1 and November 1. Michael plans to
have more details in future meetings and Summits.
Bob Ross noted that IBIS 5.1 is close to completion. He added that we need
to limit how many changes go out with each minor release.
NEW ADMINISTRATIVE ISSUES
None.
BIRD127.4: IBIS-AMI TYPOGRAPHICAL CORRECTIONS
Arpad Muranyi noted that there have been no new comments or questions
related to the BIRD127.4 revision. Bob Ross noted this is a critical BIRD
for moving ahead with IBIS-AMI. Bob said that there is a leaf/value pair
terminology that may need to be changed in the editorial process when
wrapping into IBIS 5.1. Radek Biernacki commented that he thought the BIRD
was ready for a vote.
Arpad moved to vote on the BIRD. Radek Biernacki seconded. The vote
passed with the following vote tally:
Agilent – yes
Cadence – yes
Ericsson – yes
IBM – yes
Intel – yes
IO Methodology – yes
LSI – yes
Mentor – yes
Micron – yes
Nokia Siemens Networks – yes
SiSoft – yes
Sigrity – yes
Teraspeed – yes
BIRD146: CLARIFY SAMPLE_INTERVAL FOR IBIS-AMI
There were no comments on the BIRD.
Arpad Muranyi moved to vote on the BIRD. Bob Ross seconded. The vote
passed with the following vote tally:
Agilent – yes
Cadence – yes
Ericsson – yes
IBM – yes
Intel – yes
IO Methodology – yes
LSI – yes
Mentor – yes
Micron – yes
Nokia Siemens Networks – yes
SiSoft – yes
Sigrity – yes
Teraspeed – yes
BIRD140.1: FORMAT CORNER AND RANGE CLARIFICATION FOR IBIS-AMI
Arpad Muranyi noted that after long discussion in the ATM group, it was
decided that there is enough information in IBIS to make an association
between typ/min/max corners of legacy IBIS and fast/typ/slow corners of
AMI. This BIRD is tied closely to the new BIRD148 which limits allowable
model types related to IBIS-AMI. Bob Ross noted that this BIRD has been
discussed extensively and would be ready for a vote at the next meeting.
Radek Biernacki commented that this does leave the Range format up to the
user. Arpad commented that typ/min/max values in Range have no association
to corners in IBIS. This is clarified in the BIRD. Radek felt like the
BIRD should note if there is an implied connection between Range and
corner. Bob felt Range should not have an association with corners, as it
should be used for values that can be selected by the user through the EDA
software. Arpad noted that there may be other parameter types besides
Range and Increment that need to be included in one sentence in the BIRD.
Bob felt these small editorial changes are not clear until all the BIRDs
are integrated into one document for review. Radek felt that the BIRD will
be ready to go with some minor editorial changes that could be done faster
by working offline and not in the ATM committee. Radek and Arpad will work
together to revise the BIRD.
Bob moved to schedule a revised BIRD140.2 for a vote at the next meeting.
Arpad seconded the motion. The motion passed without objection.
BIRD148: ALLOWABLE MODEL_TYPES WITH IBIS-AMI
Arpad Muranyi noted this is a new BIRD to limit the model types with which
algorithmic models can be used. This helps addressing corners in BIRD140.1
as well as eliminating the possibility of weird models that don’t make
sense. AMI models are now not allowed under Model_type Terminator, Series
or Series_switch. Another BIRD may need to be written to clarify I/O
Model_type usage, since these algorithmic models need to be split into two
models for use as an RX and a TX.
Bob Ross moved to schedule the BIRD for a vote at the next meeting. Arpad
seconded. There were no objections.
BIRD144.1: ADD TOUCHSTONE TO [EXTERNAL MODEL] AND [EXTERNAL CIRCUIT] AS A
SUPPORTED LANGUAGE
Feras Al-Hawari re-introduced the BIRD. It allows for a direct connection
of Touchstone files in IBIS without the need to wrap and instantiate such
models in a SPICE-like subcircuit such as IBIS-ISS. Arpad Muranyi noted
that the BIRD was discussed in the ATM group this week. Bob Ross added
that he supported the idea of a direct connection of Touchstone to IBIS.
He noted that you have to be careful with handling of DC voltage when using
Touchstone. Radek Biernacki felt that this was a good idea, but he wasn’t
convinced that going through IBIS-ISS wasn’t the best long term solution.
Arpad noted that this simplifies the model-maker’s life by removing the
need for an S-element wrapper, but it can also limit the flexibility.
However, he wondered if adding several options for doing the same thing
adds too much complexity to the IBIS specification. Feras said that most
simulators already support Touchstone directly, so why not make this easy
for model makers.
Ambrish Varma wondered how IBIS-ISS allows for corners. Arpad clarified
that you can parameterize Touchstone file names easily when using IBIS-ISS
as suggested in BIRDs 116-118, thereby implementing a mechanism for
unlimited corner simulations.
Michael Mirmak asked if discussions could be taken off-line. Arpad noted
that this BIRD could be brought up in ATM. Also, the BIRD will need some
way of defining terminations for unused ports of the Touchstone file.
BIRD145.1: CASCADING IBIS I/O BUFFERS WITH [EXTERNAL CIRCUIT]S USING THE
[MODEL CALL] KEYWORD
Feras Al-Hawari noted that this BIRD augments the [External Circuit] format
with a way to connect a regular IBIS buffer to other [External Circuit]
blocks. This BIRD adds a new keyword [Model Call]. This allows cascading
of Models. Bob Ross noted that he supported the idea, but it needs more
discussion to look at an integrated solution with AMI, AMS, etc.
BIRD133: MODEL CORNER C_COMP
Bob Ross moved to schedule the BIRD for a vote at the next meeting. Mike
LaBonte seconded the motion. The motion passed with no objections.
BIRD116: ADD IBIS-ISS TO [EXTERNAL MODEL] AND [EXTERNAL CIRCUIT] AS A
SUPPORTED LANGUAGE
Discussion was tabled.
BIRD117.3: PARAMETERIZE A_TO_D AND D_TO_A CONVERTERS
Discussion was tabled.
BIRD118.2: ANALOG PARAMETER ASSIGNMENTS
Discussion was tabled.
BIRD121.1: IBIS-AMI NEW RESERVED PARAMETERS FOR DATA MANAGEMENT
Discussion was tabled.
BIRD122: IBIS-AMI NEW RESERVED PARAMETERS FOR ANALOG MODELING
Discussion was tabled.
BIRD123.1: IBIS-AMI NEW RESERVED PARAMETERS FOR JITTER/NOISE
Discussion was tabled.
BIRD124: IBIS-AMI NEW RESERVED PARAMETERS FOR DEPENDENCY TABLES
Discussion was tabled.
BIRD125.1: MAKE IBIS-ISS AVAILABLE FOR IBIS PACKAGE MODELING
Discussion was tabled.
BIRD128: ALLOW AMI_PARAMETERS_OUT TO PASS AMI_PARAMETERS_IN DATA ON CALLS
TO AMI_GETWAVE
Discussion was tabled.
BIRD129: ADD “POLARITY†ARGUMENT TO D_TO_A CONVERTERS
Discussion was tabled.
BIRD 131: IBIS-AMI REPEATERS
Discussion was tabled.
BIRD147: BACK-CHANNEL SUPPORT
Discussion was tabled.
IBISCHK5 BUG STATUS
Discussion was deferred due to time limitations.
TSCHK2 BUG STATUS
Discussion was deferred due to time limitations.
NEW TECHNICAL ISSUES
None.
NEXT MEETING
The next IBIS Open Forum teleconference will be held January 6, 2011 from
8:00 to 10:00 AM US Pacific Time. Votes on BIRD133, BIRD140.2 and BIRD148
are scheduled.
========================================================================
NOTES
IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax (916) 377-3788
michael.mirmak@intel.com
Data Center Platform Applications Engineering
Intel Corporation
FM5-239
1900 Prairie City Rd.,
Folsom, CA 95630
VICE CHAIR: Lance Wang (978) 633-3388
lwang@iometh.com
President/CEO, IO Methodology, Inc.
PO Box 2099
Acton, MA 01720
SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475
rrwolff@micron.com
SI Modeling Manager, Micron Technology, Inc.
8000 S. Federal Way
Mail Stop: 01-711
Boise, ID 83707-0006
LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40
ibis-librarian@eda.org
Digital Modules Design, PDU Base Stations, Ericsson AB
BU Network
Färögatan 6
164 80 Stockholm, Sweden
WEBMASTER: Mike LaBonte
mikelabonte@eda.org
IBIS-AMI Modeling Specialist, Signal Integrity Software
6 Clock Tower Place
Maynard, MA 01754
POSTMASTER: Mike LaBonte
mikelabonte@eda.org
IBIS-AMI Modeling Specialist, Signal Integrity Software
6 Clock Tower Place
Maynard, MA 01754
This meeting was conducted in accordance with the TechAmerica Legal Guides
and TechAmerica Manual of Organization and Procedure.
The following e-mail addresses are used:
majordomo@eda.org
In the body, for the IBIS Open Forum Reflector:
subscribe ibis <your e-mail address>
In the body, for the IBIS Users' Group Reflector:
subscribe ibis-users <your e-mail address>
Help and other commands:
help
ibis-request@eda.org
To join, change, or drop from either or both:
IBIS Open Forum Reflector (ibis@eda.org)
IBIS Users' Group Reflector (ibis-users@eda.org)
State your request.
ibis-info@eda.org
To obtain general information about IBIS, to ask specific questions
for individual
response, and to inquire about joining the IBIS Open Forum as a full
Member.
ibis@eda.org
To send a message to the general IBIS Open Forum Reflector. This is
used mostly for
IBIS Standardization business and future IBIS technical enhancements.
Job posting
information is not permitted.
ibis-users@eda.org
To send a message to the IBIS Users' Group Reflector. This is used
mostly for IBIS
clarification, current modeling issues, and general user concerns.
Job posting
information is not permitted.
ibis-bug@eda.org
To report ibischk parser BUGs as well as tschk2 parser BUGs. The BUG
Report Form for ibischk resides along with reported BUGs at:
http://www.eda.org/ibis/bugs/ibischk/
http://www.eda.org/ibis/bugs/ibischk/bugform.txt
The BUG Report Form for tschk2 resides along with reported BUGs at:
http://www.eda.org/ibis/tschk_bugs/
http://www.eda.org/ibis/tschk_bugs/bugform.txt
icm-bug@eda.org
To report icmchk1 parser BUGs. The BUG Report Form resides along with
reported
BUGs at:
http://www.eda.org/ibis/icm_bugs/
http://www.eda.org/ibis/icm_bugs/icm_bugform.txt
To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which
reside at:
http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt
http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt
http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt
Information on IBIS technical contents, IBIS participants and actual IBIS
models are available on the IBIS Home page:
http://www.eda.org/ibis
Check the IBIS file directory on eda.org for more information on previous
discussions and results:
http://www.eda.org/ibis/directory.html
To create an account on the TechAmerica KAVI workspace, check out:
http://workspace.techamerica.org/kwspub/join/
Other trademarks, brands and names are the property of their respective
owners.
IBIS CURRENT MEMBER VOTING STATUS
I/O Buffer Information Specification Committee (IBIS)
|Organization |Interest |Standa|Novembe|Novembe|Novembe|Decembe|
| |Category |rds |r 15, |r 18, |r 21, |r 9, |
| | |Ballot|2011 |2011 |2011 |2011 |
| | |Voting| | | | |
| | |Status| | | | |
|Advanced Micro |Producer |Inacti|- |X |- |- |
|Devices | |ve | | | | |
|Agilent |User |Active|- |X |- |X |
|Technologies | | | | | | |
|Altera |Producer |Inacti|- |- |- |- |
| | |ve | | | | |
|ANSYS |User |Active|X |X |X |- |
|Apple Computer |User |Inacti|- |- |- |- |
| | |ve | | | | |
|Applied Simulation|User |Inacti|- |X |- |- |
|Technology | |ve | | | | |
|Cadence Design |User |Active|X |X |X |X |
|Systems | | | | | | |
|Cisco Systems |User |Inacti|X |- |- |- |
| | |ve | | | | |
|Ericsson |Producer |Active|X |X |X |X |
|Foxconn Technology|Producer |Inacti|- |- |X |- |
|Group | |ve | | | | |
|Freescale |Producer |Inacti|- |X |- |- |
| | |ve | | | | |
|Green Streak |General |Inacti|- |- |- |- |
|Programs |Interest |ve | | | | |
|Huawei |Producer |Inacti|X |- |- |- |
|Technologies | |ve | | | | |
|IBM |Producer |Active|- |- |X |X |
|Infineon |Producer |Inacti|- |- |- |- |
|Technologies AG | |ve | | | | |
|Intel Corp. |Producer |Active|X |- |X |X |
|IO Methodology |User |Active|X |- |X |X |
|LSI |Producer |Inacti|- |- |- |X |
| | |ve | | | | |
|Mentor Graphics |User |Active|- |X |- |X |
|Micron Technology |Producer |Inacti|- |- |- |X |
| | |ve | | | | |
|Nokia Siemens |Producer |Inacti|X |- |- |X |
|Networks | |ve | | | | |
|QLogic |Producer |Inacti|- |- |- |- |
| | |ve | | | | |
|Signal Integrity |User |Inacti|- |- |- |X |
|Software | |ve | | | | |
|Sigrity |User |Active|X |- |X |X |
|Synopsys |User |Inacti|X |- |- |- |
| | |ve | | | | |
|Teraspeed |General |Active|X |X |X |X |
|Consulting |Interest | | | | | |
|Texas Instruments |Producer |Inacti|- |- |- |- |
| | |ve | | | | |
|Toshiba |Producer |Inacti|- |X |- |- |
| | |ve | | | | |
|Xilinx |Producer |Inacti|- |- |- |- |
| | |ve | | | | |
|ZTE |User |Inacti|X |- |- |- |
| | |ve | | | | |
|Zuken |User |Inacti|- |X |- |- |
| | |ve | | | | |
Criteria for Member in good standing:
• Must attend two consecutive meetings to establish voting membership
• Membership dues current
• Must not miss two consecutive Meetings
Interest categories associated with TechAmerica ballot voting are:
• Users - Members that utilize electronic equipment to provide services
to an end user.
• Producers - Members that supply electronic equipment.
• General Interest - Members are neither producers nor users. This
category includes, but is not limited to, Government, regulatory
agencies (state and federal), researchers, other organizations and
associations, and/or consumers.