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The Interconnect Task Group exists to create, maintain, and promote multiple specifications related to modeling and representing measurement data for interconnects, including device packages, cable/connector assemblies, modular sub-systems, and printed circuit board (PCB) traces. The Task Group began as the Connector Task Group, but a new name was applied after the group's work began to expand to several other advanced modeling topics related to interconnects. The chair of the Task Group is Michael Mirmak (michael.mirmak@intel.com). Task Group ProductsTo see individual documents produced by the Task Group see the Presentation Archive. The Connector Task Group produced the IBIS Interconnect Modeling Specification, formerly the IBIS Connector Modeling Specification (ICM), which was released in 2005. This document can be viewed at the ICM page. Since becoming the Interconnect Task Group, the team has focused on two major areas:
These specifications are intended for use both independently of IBIS as well as for describing interconnects within IBIS structures, including for packaging, such as IBIS AMI, C Comp Model, EMD and IBIS Interconnect. A parser for Touchstone is available at the TSCHK2 page. The team is currently focused on technical changes to Touchstone, to become Touchstone 3.0. Approved and proposed changes to Touchstone can be viewed at the TSIRDs page. Working documents related to Touchstone revisions can be seen on the Presentation Archive. The team will next turn to revisions to IBIS-ISS. Approved and proposed changes to IBIS-ISS can be viewed at the ISSIRDs page.Email discussionTo join the email discussion list, visit: https://www.freelists.org/list/ibis-interconn. There you can signup to receive list email, and view the archive of messages. MeetingsAn Interconnect Task Group teleconference is held weekly on Wednedays from 11 AM to 12 PM US Eastern Time. Meeting notices, including call-in information, are sent to the discussion list. Meeting minutes are archived here and on the discussion list. |